Technologies of electrochemical deposition of metals on a semiconductor wafer of various mems microforms

Abstract

The technology of formation of nanostructured materials with high physical and mechanical properties is considered. It allows significantly improve the quality and reliability of the moving elements of systems. The results of the choice of the optimal bath for electrochemical deposition of copper and cobalt-phosphorus alloy to obtain metal structures on a substrate of high quality and strength are presented. For the formation of components of complex microsystems, filling by the method of galvanic codeposition is proposed. The technology of deposition of coatings from metals, alloys, as well as composite coatings on a surface with a complex nanometer configuration has been developed. Samples were obtained and showed absence of typical defects such as voids, seams, as well as increased coarse grained structure