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https://elib.bsu.by/handle/123456789/247367| Title: | Природа адгезии в системе полимер – металлическое покрытие, осажденное из раствора |
| Authors: | Воробьева, Т. Н. Свиридов, В. В. |
| Keywords: | ЭБ БГУ::ЕСТЕСТВЕННЫЕ И ТОЧНЫЕ НАУКИ::Химия |
| Issue Date: | 1996 |
| Publisher: | Минск : Універсітэцкае |
| Citation: | Вестник Белорусского государственного университета. Сер. 2, Химия. Биология. География. – 1996. – № 1. – С. 23-29. |
| Abstract: | The investigation of composition and micro structure of interface in film system copper-polyimide formed in the process of electroless copper plating on the surface activated by tin and palladium compounds has shown that the near surface layer of metallized substrate 30 nm in thickness includes fine particles of Cu, Pd, their oxides, Sn(II) and Sn(IV) oxo and hydroxo compounds. A sufficient part of Cu, Sn and Pd atoms form C-O-Me and C-N-Me bonds in the result of metal ion interaction with carboxyl and amido groups |
| URI: | https://elib.bsu.by/handle/123456789/247367 |
| ISSN: | 0372-5340 |
| Licence: | info:eu-repo/semantics/openAccess |
| Appears in Collections: | 1996, №1 (февраль) |
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