Ion beam assisted deposition of layers on metals

Abstract

New original approach was proposed by the authors in order to realize in situ nitrogen implantation and Au deposition on copper samples by the same ion beam. The developed simulation software enabled us to describe ion beam assisted deposition process as well as to calculate radial and depth distribution of deposited/introduced particles. The simulations yield definite conclusions on influence of ion beam energy, fluence and particular geometry of a sputter. Experimental results (RBS) are also presented that made possible to obtain depth distribution of Au and nitrogen atoms in copper. The observed variation in thickness of the deposited layers, their uniformity and an efficiency of the layer-substrate intermixing is discussed and interpreted on the basis of both simulation results and experimental data.