Высоко адгезионная металлизация керамики пленками оксида титана изменяющегося по толщине состава

Abstract

Ceramic metallization by magnetron sputtered titanium oxide layers due to the creation of a transitional layer with the gradually changing composition is proposed. The chemical formula of the composition is changed from TiO2 to the pure Ti. The controlled reactive magnetron sputtering technology is used to form such a layer. The Auger-spectral analysis results for the Ti - TiOx - ТіО2 - substrate structures are considered. The influence of thermal annealing on the concentration allocation profiles of elements involved in these structures as well as on the electrical and physical properties (surface resistance, adhesion) is discussed. The adhesion strengths of the Ti - TiOx - ТiО2 - substrate structures are compared with the data obtained for vacuum-arc, thermal and magnetron sputtering of metals on ceramics and silicon.